Invention Grant
- Patent Title: Heat dissipating device
- Patent Title (中): 散热装置
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Application No.: US13300132Application Date: 2011-11-18
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Publication No.: US09342110B2Publication Date: 2016-05-17
- Inventor: Chun-Chieh Wong , Cheng-Yu Wang
- Applicant: Chun-Chieh Wong , Cheng-Yu Wang
- Applicant Address: TW Taipei
- Assignee: ASUSTEK COMPUTER INC.
- Current Assignee: ASUSTEK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: F28F7/00
- IPC: F28F7/00 ; G06F1/16 ; H01L23/467 ; H05K7/20 ; F28F3/02
Abstract:
A heat dissipating device includes a supporting part, a plurality of first fins and a plurality of second fins. The first fins are disposed in a vertical array at the supporting part. The second fins are disposed in an inclined array at the supporting part. The first fins and the second fins are staggeredly disposed and adjacent to each other correspondingly. The heat exchange efficiency of the fins is improved so as to increase the heat dissipating efficiency of the heat dissipating device.
Public/Granted literature
- US20120138284A1 HEAT DISSIPATING DEVICE Public/Granted day:2012-06-07
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