Invention Grant
- Patent Title: Soft post package repair of memory devices
- Patent Title (中): 软件包修复内存设备
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Application No.: US14246589Application Date: 2014-04-07
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Publication No.: US09343184B2Publication Date: 2016-05-17
- Inventor: Alan J. Wilson , Jeffrey Wright
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G11C7/00
- IPC: G11C7/00 ; G11C29/00 ; G11C11/418 ; G11C17/16 ; G11C17/18 ; G11C11/408 ; G11C29/44

Abstract:
Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.
Public/Granted literature
- US20150287480A1 SOFT POST PACKAGE REPAIR OF MEMORY DEVICES Public/Granted day:2015-10-08
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