发明授权
- 专利标题： Conductive paste composition for external electrode and multilayer ceramic electronic component including the same
- 专利标题（中）： 用于外部电极的导电糊组合物和包括其的多层陶瓷电子部件
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申请号： US14061077申请日： 2013-10-23
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公开(公告)号： US09343232B2公开(公告)日： 2016-05-17
- 发明人: Jae Hwan Han , Byoung Jin Chun , Kyung Pyo Hong , Hyun Hee Gu , Byung Jun Jeon
- 申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2013-0083687 20130716
- 主分类号： H01G4/30
- IPC分类号： H01G4/30 ; H01G4/008 ; H01B1/22 ; H01G4/232 ; H01G4/12
摘要：
There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.
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