Invention Grant
- Patent Title: Method of making contact posts for a microelectromechanical device
- Patent Title (中): 制造微机电装置接触柱的方法
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Application No.: US11767413Application Date: 2007-06-22
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Publication No.: US09343242B2Publication Date: 2016-05-17
- Inventor: Lianjun Liu
- Applicant: Lianjun Liu
- Applicant Address: FR Paris
- Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Current Assignee Address: FR Paris
- Agency: Pearne & Gordon LLP
- Main IPC: H01H1/00
- IPC: H01H1/00 ; B81C1/00 ; H01H1/06 ; H01H1/20 ; H01H11/04

Abstract:
A device 20 includes a substrate 22 coupled with a substrate 24 such that a volume 32 is formed between the substrates 22, 24. Contact posts 48, 50 on the substrate 22 and a cantilever beam structure 36 on the substrate 24 are located within the volume 32. The cantilever beam structure has a conductive trace 38 that is selectively contactable with the contact posts 48, 50 to yield a microelectromechanical (MEMS) switch within the volume 32. Fabrication methodology for making the contact posts 48, 50 entails forming post protrusions 68, 70 on the substrate 22 and shaping post protrusions 68, 70 so that they acquire a rounded shape. Input and output signal lines 42, 44 are constructed such that respective portions of input and output signal lines 42, 44 overly corresponding post protrusions 68, 70 and take on the shape of post protrusions 68, 70.
Public/Granted literature
- US20080314723A1 METHOD OF MAKING CONTACT POSTS FOR A MICROELECTROMECHANICAL DEVICE Public/Granted day:2008-12-25
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