Invention Grant
- Patent Title: Package on package structure and fabrication method thereof
- Patent Title (中): 封装结构及其制造方法
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Application No.: US14452871Application Date: 2014-08-06
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Publication No.: US09343387B2Publication Date: 2016-05-17
- Inventor: Chu-Chi Hsu , Lung-Yuan Wang , Cheng-Chia Chiang , Chia-Kai Shih , Shu-Huei Huang
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103107386A 20140305
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L25/10 ; H01L23/498 ; H01L25/065 ; H01L25/00 ; H01L23/00 ; H01L25/16
Abstract:
A package on package (PoP) structure is provided, which includes: a packaging substrate having a plurality of conductive bumps, wherein each of the conductive bumps has a metal ball and a solder material covering the metal ball; and an electronic element having a plurality of conductive posts, wherein the electronic element is stacked on the packaging substrate by correspondingly bonding the conductive posts to the conductive bumps, and each of the conductive posts and the corresponding conductive bump form a conductive element. The present invention facilitates the stacking process through butt joint of the conductive posts and the metal balls of the conductive bumps.
Public/Granted literature
- US20150255360A1 PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2015-09-10
Information query
IPC分类:
