发明授权
- 专利标题: No flow underfill or wafer level underfill and solder columns
- 专利标题(中): 无流动底部填充或晶圆级底部填充和焊料柱
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申请号: US14526268申请日: 2014-10-28
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公开(公告)号: US09343423B2公开(公告)日: 2016-05-17
- 发明人: Claudius Ferger , Michael A. Gaynes , Jae-Woong Nah , Da-Yuan Shih
- 申请人: Claudius Ferger , Michael A. Gaynes , Jae-Woong Nah , Da-Yuan Shih
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: The Law Offices of Robert J. Eichelburg
- 代理商 Robert J. Eichelburg
- 主分类号: H01L21/50
- IPC分类号: H01L21/50 ; H01L21/48 ; H01L23/00 ; H01L23/498 ; H01L21/463 ; H01L23/544
摘要:
A preassembly semiconductor device comprises chip soldering structures on a semiconductor chip and substrate soldering structures on a substrate corresponding to the chip soldering structures. The substrate soldering structures extend toward the chip soldering structures for forming solder connections with the chip soldering structures. The chip and the substrate are in preassembly positions relative to one another. The height of the substrate soldering structures is greater than the height of the chip soldering structures. A pre-applied underfill is contiguous with the substrate and is sufficiently thick so as to extend substantially no further than the full height of the substrate soldering structures. In another embodiment the height of the chip soldering structures is greater than the height of the substrate soldering structures and the pre-applied underfill is contiguous with the semiconductor chip and sufficiently thick so as to extend substantially no further than the full height of the chip soldering structures. A process comprises manufacturing semiconductor assemblies from these devices by soldering the chip and the substrate to one another.