An optoelectronic packaged device includes stacked components within a package including a package substrate providing side and a bottom wall. The stacked components includes a comb structure on the bottom wall formed from a material having a thermal resistance > a substrate material for the bottom die providing spaced apart teeth separated by gaps. The bottom die has a top surface including electrical trace(s) and a light source die for emitting light coupled to the electrical trace and a bottom surface on the comb structure. A first cavity die is on the top surface of the bottom die or on legs of the package which extend above the bottom wall. An optics die is on the first cavity die, a second cavity die is on a sealing die which is on the optics die, and a photodetector (PD) die is optically coupled to receive light from the light source die.