Invention Grant
- Patent Title: Three-dimensional devices having reduced contact length
- Patent Title (中): 具有减小的接触长度的三维装置
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Application No.: US14615830Application Date: 2015-02-06
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Publication No.: US09343479B2Publication Date: 2016-05-17
- Inventor: Toru Tanzawa
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L27/115
- IPC: H01L27/115

Abstract:
Various embodiments comprise apparatuses and methods including a memory array having alternating levels of semiconductor materials and dielectric material with strings of memory cells formed on the alternating levels. One such apparatus includes a memory array formed starting adjacent to a surface of a substrate. Peripheral circuitry is formed on an elevated portion that is adjacent to the memory array and has an uppermost portion substantially coplanar with an uppermost surface of the memory array. Additional apparatuses and methods are described.
Public/Granted literature
- US20150155298A1 THREE-DIMENSIONAL DEVICES HAVING REDUCED CONTACT LENGTH Public/Granted day:2015-06-04
Information query
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