发明授权
- 专利标题: High-voltage semiconductor device and method for manufacturing the same
- 专利标题(中): 高压半导体器件及其制造方法
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申请号: US14603997申请日: 2015-01-23
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公开(公告)号: US09343572B1公开(公告)日: 2016-05-17
- 发明人: Chung-Ren Lao , Hsing-Chao Liu , Chu-Feng Chen , Wei-Chun Chou
- 申请人: Vanguard International Semiconductor Corporation
- 申请人地址: TW Hsinchu
- 专利权人: Vangaurd International Semiconductor Corporation
- 当前专利权人: Vangaurd International Semiconductor Corporation
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/40 ; H01L29/08 ; H01L29/10 ; H01L29/66
摘要:
A high-voltage semiconductor device is provided. The high-voltage semiconductor device includes a substrate; an epitaxial layer and a gate structure; a first conductive type first high-voltage well region and a second conductive type high-voltage well region disposed in the epitaxial layer at opposite sides of the gate structure respectively, wherein the first conductive type is different from the second conductive type; a source region and a drain region; and a stack structure disposed between the gate structure and the drain region, wherein the stack structure includes: a blocking layer; an insulating layer disposed over the blocking layer; and a conductive layer disposed over the insulating layer and electrically connected the source region or the gate structure. A method for manufacturing the high-voltage semiconductor device is also provided.
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