Invention Grant
- Patent Title: Encapsulation housing and LED module with the same
- Patent Title (中): 封装外壳和LED模块相同
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Application No.: US14124255Application Date: 2012-05-11
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Publication No.: US09343632B2Publication Date: 2016-05-17
- Inventor: Yaojun Feng , Yuanyuan He , Yubao He , Canbang Yang
- Applicant: Yaojun Feng , Yuanyuan He , Yubao He , Canbang Yang
- Applicant Address: DE Munich
- Assignee: OSRAM GmbH
- Current Assignee: OSRAM GmbH
- Current Assignee Address: DE Munich
- Agency: Viering, Jentschura & Partner mbB
- Priority: CN201110151093 20110607
- International Application: PCT/EP2012/058802 WO 20120511
- International Announcement: WO2012/168031 WO 20121213
- Main IPC: H01L33/48
- IPC: H01L33/48 ; F21V15/01 ; B29C65/54 ; B29C65/00 ; H05K3/28
Abstract:
An encapsulation housing for a LED module, may include an upper housing and a lower housing joined together and defining together a cavity, wherein at least one of the upper housing and the lower housing has an inner partition wall partitioning the cavity into an assembly cavity and an anti-leakage cavity encircling the assembly cavity.
Public/Granted literature
- US20140124824A1 ENCAPSULATION HOUSING AND LED MODULE WITH THE SAME Public/Granted day:2014-05-08
Information query
IPC分类:
