Invention Grant
- Patent Title: Substrate having laser sintered underplate
- Patent Title (中): 基板具有激光烧结底板
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Application No.: US12913839Application Date: 2010-10-28
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Publication No.: US09346114B2Publication Date: 2016-05-24
- Inventor: Thomas A. Hertel
- Applicant: Thomas A. Hertel
- Applicant Address: US CA Canoga Park
- Assignee: AEROJET ROCKETDYNE OF DE, INC.
- Current Assignee: AEROJET ROCKETDYNE OF DE, INC.
- Current Assignee Address: US CA Canoga Park
- Agent Joel G Landau
- Main IPC: B22F3/105
- IPC: B22F3/105 ; B23K1/00 ; B22F7/04 ; B32B15/01 ; H01L23/00
Abstract:
A substrate includes a metal portion and an underplate that is laser sintered to the metal portion. The metal portion has a melting point that is lower than a sintering temperature of the underplate.
Public/Granted literature
- US20110268982A1 SUBSTRATE HAVING LASER SINTERED UNDERPLATE Public/Granted day:2011-11-03
Information query
