Invention Grant
- Patent Title: Two-way roundness device
- Patent Title (中): 双向圆度装置
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Application No.: US14297049Application Date: 2014-06-05
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Publication No.: US09347761B2Publication Date: 2016-05-24
- Inventor: Darcy Thomas Montgomery
- Applicant: Cedarflat Precision Inc.
- Applicant Address: CA Burnaby
- Assignee: Cedarflat Precision Inc.
- Current Assignee: Cedarflat Precision Inc.
- Current Assignee Address: CA Burnaby
- Agency: Miltons IP/p.i.
- Main IPC: G01B5/20
- IPC: G01B5/20

Abstract:
A two way roundness device can be configured as a device in which a tool, such as an indicator rotates or as a device in which the part to be measured or cut rotates. This ability to alternate between these two configurations is enabled by a combination of a rotating spindle assembly and a two-axis stage that can be oriented, in use, with the two-axis stage under the spindle assembly or with the two-axis stage on top of the spindle assembly.
Public/Granted literature
- US20140360035A1 TWO-WAY ROUNDNESS DEVICE Public/Granted day:2014-12-11
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