Invention Grant
- Patent Title: Splice chips for optical fiber splice cassettes
- Patent Title (中): 用于光纤拼接盒的接头芯片
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Application No.: US13901112Application Date: 2013-05-23
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Publication No.: US09348105B2Publication Date: 2016-05-24
- Inventor: Paula Rudenick , Scott C. Sievers , Oscar Fernando Bran de León , Gustavo Cano , Raul Mario Saucedo
- Applicant: ADC Telecommunications, Inc.
- Applicant Address: US NC Hickory
- Assignee: CommScope Technologies LLC
- Current Assignee: CommScope Technologies LLC
- Current Assignee Address: US NC Hickory
- Agency: Merchant & Gould P.C.
- Main IPC: G02B6/00
- IPC: G02B6/00 ; G02B6/44

Abstract:
A splice chip includes a base, separation members extending upwardly from the base to define a plurality of rows, and latching fingers extending upwardly from the base to further define the rows. At least one of the rows includes at least a first latching finger, a second latching finger, and a third latching finger. The third latching finger is shorter than the first and second latching fingers. The second latching finger is shorter than the first latching finger. The row also may include a fourth latching finger that is the same height as the first latching finger.
Public/Granted literature
- US20140205254A1 SPLICE CHIPS FOR OPTICAL FIBER SPLICE CASSETTES Public/Granted day:2014-07-24
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