发明授权
- 专利标题： Semiconductor package and electronic apparatus including the same
- 专利标题（中）： 半导体封装和包括其的电子设备
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申请号： US14810430申请日： 2015-07-27
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公开(公告)号： US09349684B2公开(公告)日： 2016-05-24
- 发明人: Hyuk-su Kim , Tae-ho Kang , Tae-hee Song , Won-cheol Lee
- 申请人： Hyuk-su Kim , Tae-ho Kang , Tae-hee Song , Won-cheol Lee
- 申请人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- 代理机构： Muir Patent Law, PLLC
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L27/088 ; H05K1/02 ; H01L23/31 ; H01L25/065 ; H01L23/04
摘要：
Provided are a curved semiconductor package, and a device including the semiconductor package. The semiconductor package includes: a flexible printed circuit board (PCB) including a fixed bent portion formed as an arch-shape and including a first surface facing a first direction and a second surface opposite to the first surface; at least one semiconductor chip attached to the second surface of the fixed bent portion of the flexible PCB; and a mold layer having rigidity and formed on the second surface of the fixed bending portion of the flexible PCB while surrounding the at least one semiconductor chip.
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