Invention Grant
- Patent Title: Light emitter packages, systems, and methods
- Patent Title (中): 光发射器封装，系统和方法
-
Application No.: US13713410Application Date: 2012-12-13
-
Publication No.: US09349929B2Publication Date: 2016-05-24
- Inventor: Joseph G. Clark , Amber C. Abare , David T. Emerson , Jeremy S. Nevins , Raymond Rosado , Michael Bergmann
- Applicant: CREE, Inc.
- Applicant Address: US NC Durham
- Assignee: Cree, Inc.
- Current Assignee: Cree, Inc.
- Current Assignee Address: US NC Durham
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Main IPC: H01L33/58
- IPC: H01L33/58 ; F21V21/00 ; H01L33/50 ; F21V7/00 ; H01L25/075 ; H01L33/54 ; F21K99/00 ; F21Y101/02 ; F21Y105/00
Abstract:
Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
Public/Granted literature
- US20130322070A1 LIGHT EMITTER PACKAGES, SYSTEMS, AND METHODS Public/Granted day:2013-12-05
Information query
IPC分类:
