Invention Grant
- Patent Title: Material heating and providing apparatus
- Patent Title (中): 材料加热和提供装置
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Application No.: US13720158Application Date: 2012-12-19
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Publication No.: US09351346B2Publication Date: 2016-05-24
- Inventor: Tsuyoshi Arai , Satoshi Takeuchi , Noriyasu Inomata
- Applicant: DENSO CORPORATION
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Oliff PLC
- Priority: JP2012-036015 20120222
- Main IPC: H05B6/46
- IPC: H05B6/46 ; H05B6/64

Abstract:
A dielectric heating system which is provided with a high frequency oscillator, a housing which forms part of a waveguide and is provided with a loading opening and unloading opening, first and second conductive closing members which respectively close the loading opening and the unloading opening from the inner side of the housing, and a first position holding member which holds the object to be heated inside the housing, which makes the first conductive closing member slide to open the loading opening and charges the object to be heated into the housing, and which makes the second conductive closing member slide to open the unloading opening and unload the object to outside the housing.
Public/Granted literature
- US20130213957A1 MATERIAL HEATING AND PROVIDING APPARATUS Public/Granted day:2013-08-22
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