Invention Grant
- Patent Title: Printhead structure
- Patent Title (中): 打印头结构
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Application No.: US14890494Application Date: 2013-06-28
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Publication No.: US09352560B2Publication Date: 2016-05-31
- Inventor: Mark Sanders Taylor , Craig Olbrich , Byron K. Davis
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- International Application: PCT/US2013/048676 WO 20130628
- International Announcement: WO2014/209379 WO 20141231
- Main IPC: B41J2/15
- IPC: B41J2/15 ; B41J2/145 ; B41J2/05 ; B41J3/60 ; B41J2/14

Abstract:
In one example, a printhead structure includes: a first layer; an array of openings in the first layer to form printing fluid ejection chambers; a second layer on the first layer; an array of orifices through the second layer, each orifice located adjacent to one of the openings in the first layer; a groove in the first layer spanning substantially a full length of the array of openings; and multiple holes through the second layer to the groove in the first layer.
Public/Granted literature
- US20160107442A1 PRINTHEAD STRUCTURE Public/Granted day:2016-04-21
Information query
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