Invention Grant
- Patent Title: Thermally conductive clay
- Patent Title (中): 导热粘土
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Application No.: US14461753Application Date: 2014-08-18
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Publication No.: US09353245B2Publication Date: 2016-05-31
- Inventor: Pei Tien , Chao-Yuan Wang , Mei-Chin Liao , Wei-Yu Chen
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Main IPC: C08K3/38
- IPC: C08K3/38 ; C08K3/18 ; C08K5/521 ; C08K5/01 ; C08K3/22 ; C08K3/08 ; G06F1/20
Abstract:
The present invention is a thermally conductive clay including a carrier oil, a dispersant, a styrene polyolefin copolymer and thermally conductive particles.
Public/Granted literature
- US20160046791A1 THERMALLY CONDUCTIVE CLAY Public/Granted day:2016-02-18
Information query
