发明授权
- 专利标题： Test-yield improvement devices for high-density probing techniques and method of implementing the same
- 专利标题（中）： 用于高密度探测技术的测试产量改进装置及其实施方法
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申请号： US13865243申请日： 2013-04-18
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公开(公告)号： US09354254B2公开(公告)日： 2016-05-31
- 发明人: Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Wei-Hsun Lin , Sen-Kuei Hsu , De-Jian Liu
- 申请人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Duane Morris LLP
- 主分类号： G01R31/20
- IPC分类号： G01R31/20 ; G01R1/073 ; G01R1/067
摘要：
A testing apparatus with reduced warping of the probe card and a method of reducing warping of a probe card of a testing apparatus are disclosed. The testing apparatus can include a testing head and a platform opposite the testing head, where the testing head and platform move relative to one another to bring a sample into contact with probing tips of the testing apparatus. The testing head can include a probe card printed circuit board, a stiffener, a discontinuous backer and a plurality of probing tips. The stiffener can be coupled to and reinforcing the probe card. The discontinuous backer can extend from the probe card to the stiffener, and can include at least one unfilled void extending from the stiffener to the probe card. The plurality of probing tips can extend from a distal end of the testing head.
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