A packaged semiconductor device has a top and a bottom and includes a lead frame, a die, and an encapsulant that encapsulates the die and most of the lead frame. The lead frame includes a die pad on which the die is mounted, leads electrically connected to the die such as with bond wires, and die pad extensions that fan out from the die pad. Each die-pad extension has a proximal segment and a distal segment. The distal segments are interleaved with the leads. The bottoms of the die pad and the proximal segments of the extensions may be exposed at the bottom of the device. The top of the device may have notches corresponding to the extensions and portions of the distal segments may be exposed and bent into corresponding ones of the notches at the top of the device.