Invention Grant
- Patent Title: Electronic device and method for fabricating an electronic device
- Patent Title (中): 用于制造电子设备的电子设备和方法
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Application No.: US13944927Application Date: 2013-07-18
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Publication No.: US09355984B2Publication Date: 2016-05-31
- Inventor: Irmgard Escher-Poeppel , Eduard Knauer , Thomas Kunstmann , Peter Scherl , Raimund Foerg
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/373
Abstract:
An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.
Public/Granted literature
- US20150021792A1 ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE Public/Granted day:2015-01-22
Information query
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