Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
-
Application No.: US14516673Application Date: 2014-10-17
-
Publication No.: US09356016B2Publication Date: 2016-05-31
- Inventor: Chin-Shan Wang , Jian-Hong Lin , Shun-Yi Lee
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L27/07
- IPC: H01L27/07 ; H01L27/06 ; H01L29/49 ; H01L49/02 ; H01L29/423 ; H01L29/66

Abstract:
A semiconductor device includes a semiconductor substrate, a transistor, a conductive contact and a capacitor. The transistor is formed on the semiconductor substrate, and the transistor includes a gate, a source and a drain. The conductive contact is formed on and in contact with at least one of the source and the drain. The capacitor includes a first electrode and a second electrode spaced apart from first electrode. At least one of the first and second electrodes extends on substantially the same level as the conductive contact or the gate. A method of forming the semiconductor device is provided as well.
Public/Granted literature
- US20160111418A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-04-21
Information query
IPC分类: