Invention Grant
- Patent Title: Method for manufacturing semiconductor device having antifuse with semiconductor and insulating films as intermediate layer
- Patent Title (中): 制造具有半导体反熔丝的半导体器件和绝缘膜作为中间层的方法
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Application No.: US14656322Application Date: 2015-03-12
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Publication No.: US09356030B2Publication Date: 2016-05-31
- Inventor: Ryota Tajima , Hajime Tokunaga
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2007-064490 20070314
- Main IPC: H01L27/112
- IPC: H01L27/112 ; H01L27/10 ; H01L23/525

Abstract:
An object is to provide an antifuse with little power consumption at the time of writing. The antifuse is used for a memory element in a read-only memory device. The antifuse includes a first conductive layer, a multilayer film of two or more layers in which an amorphous silicon film and an insulating film are alternately stacked over the first conductive layer, and a second conductive layer over the multilayer film. Voltage is applied between the first and second conductive layers and resistance of the multilayer film is decreased, whereby data is written to the memory element. When an insulating film having higher resistance than amorphous silicon is formed between the first and second conductive layers, current flowing through the antifuse at the time of writing is reduced.
Public/Granted literature
- US20150187779A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2015-07-02
Information query
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