Semiconductor devices comprising floating gate transistors and methods of forming such semiconductor devices

Invention Grant

US09356157B2 Semiconductor devices comprising floating gate transistors and methods of forming such semiconductor devices 有权

Title translation: 包括浮栅晶体管的半导体器件和形成这种半导体器件的方法

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Patent Title: Semiconductor devices comprising floating gate transistors and methods of forming such semiconductor devices
Patent Title (中): 包括浮栅晶体管的半导体器件和形成这种半导体器件的方法
Application No.: US14223410

Application Date: 2014-03-24
Publication No.: US09356157B2

Publication Date: 2016-05-31
Inventor: Gurtej S. Sandhu , Chandra V. Mouli , Di Li
Applicant: Micron Technology, Inc.
Applicant Address: US ID Boise
Assignee: Micron Technology, Inc.
Current Assignee: Micron Technology, Inc.
Current Assignee Address: US ID Boise
Agency: TraskBritt
Main IPC: H01L29/788
IPC: H01L29/788 ; H01L51/52 ; H01L51/56 ; H01L21/28 ; H01L29/423 ; H01L29/66

Semiconductor devices comprising floating gate transistors and methods of forming such semiconductor devices

Abstract:

Semiconductor devices include one or more transistors having a floating gate and a control gate. In at least one embodiment, the floating gate comprises an intermediate portion extending between two end portions. The intermediate portion has an average cross-sectional area less than one or both of the end portions. In some embodiments, the intermediate portion may comprise a single nanowire. In additional embodiments, semiconductor devices have one or more transistors having a control gate and a floating gate in which a surface of the control gate opposes a lateral side surface of a floating gate that defines a recess in the floating gate. Electronic systems include such semiconductor devices. Methods of forming semiconductor devices include, for example, forming a floating gate having an intermediate portion extending between two end portions, and configuring the intermediate portion to have an average cross-sectional area less than one or both of the end portions.

Abstract(Chinese):

半导体器件包括具有浮置栅极和控制栅极的一个或多个晶体管。在至少一个实施例中，浮动门包括在两个端部之间延伸的中间部分。中间部分具有小于一个或两个端部的平均横截面面积。在一些实施例中，中间部分可以包括单个纳米线。在另外的实施例中，半导体器件具有一个或多个具有控制栅极和浮置栅极的晶体管，其中控制栅极的表面与浮置栅极的限定了浮动栅极中的凹部的横向侧表面相对。电子系统包括这样的半导体器件。形成半导体器件的方法包括例如形成具有在两个端部之间延伸的中间部分的浮动栅极，并且将中间部分构造成具有小于一个或两个端部的平均横截面积。

Public/Granted literature

US20140252449A1 SEMICONDUCTOR DEVICES COMPRISING FLOATING GATE TRANSISTORS AND METHODS OF FORMING SUCH SEMICONDUCTOR DEVICES Public/Granted day:2014-09-11

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L29/00	专门适用于整流、放大、振荡或切换，并具有至少一个电位跃变势垒或表面势垒的半导体器件；具有至少一个电位跃变势垒或表面势垒，例如PN结耗尽层或载流子集结层的电容器或电阻器；半导体本体或其电极的零部件（H01L31/00至H01L47/00，H01L51/05优先；除半导体或其电极之外的零部件入H01L23/00；由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00）
H01L29/66	.按半导体器件的类型区分的
H01L29/68	..只能通过对一个不通有待整流、放大或切换的电流的电极供给电流或施加电位方可进行控制的（H01L29/96优先）
H01L29/76	...单极器件
H01L29/772	....场效应晶体管
H01L29/78	.....由绝缘栅产生场效应的
H01L29/788	......带有浮栅的