发明授权
- 专利标题: Utilization of antenna loading for impedance matching
- 专利标题(中): 利用天线负载进行阻抗匹配
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申请号: US13745609申请日: 2013-01-18
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公开(公告)号: US09356343B2公开(公告)日: 2016-05-31
- 发明人: Alireza Mahanfar , Javier Rodriguez De Luis , Stanley Yu Tao Ng , Benjamin J. Shewan , Kim Willi Schulze
- 申请人: Microsoft Technology Licensing, LLC
- 申请人地址: US WA Redmond
- 专利权人: Microsoft Technology Licensing, LLC
- 当前专利权人: Microsoft Technology Licensing, LLC
- 当前专利权人地址: US WA Redmond
- 代理商 Judy Yee; Micky Minhas
- 主分类号: H01Q1/24
- IPC分类号: H01Q1/24 ; H01Q21/00 ; H01Q1/50
摘要:
Techniques for utilization of antenna loading for impedance matching are described. In at least some embodiments, a device (e.g., a smart phone) includes multiple antennas that are employed to send and receive wireless signals for the device. The device further includes impedance matching functionality communicatively connected to the antennas, and configured to perform impedance matching for one of the antennas based on loading (e.g., dielectric loading) of another of the antennas.
公开/授权文献
- US20140203980A1 Utilization of Antenna Loading for Impedance Matching 公开/授权日:2014-07-24
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