Invention Grant
- Patent Title: Multi-mode integrated power amplifier
- Patent Title (中): 多模集成功率放大器
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Application No.: US14449810Application Date: 2014-08-01
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Publication No.: US09356560B2Publication Date: 2016-05-31
- Inventor: Saihua Lin , Alan Ngar Loong Chan
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Paradice and Li LLP
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H03F3/72 ; H03F1/02 ; H03F3/21 ; H03F3/19 ; H04B1/401

Abstract:
A method and apparatus are disclosed for transmitting communication signals through a multi-mode power amplifier. For at least some embodiments, a communication signal may be amplified by an amplifier of the multi-mode power amplifier selected based on a desired transmit output power. The output of the selected amplifier may be coupled through a configurable inductive element to an antenna. The inductive element may be configured as a balun or as an inductive load element based on an operating mode of the multi-mode power amplifier.
Public/Granted literature
- US20160036390A1 MULTI-MODE INTEGRATED POWER AMPLIFIER Public/Granted day:2016-02-04
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