发明授权
US09357630B2 Epoxy resin compound and radiant heat circuit board using the same
有权
环氧树脂复合物和使用其的辐射热电路板
- 专利标题： Epoxy resin compound and radiant heat circuit board using the same
- 专利标题（中）： 环氧树脂复合物和使用其的辐射热电路板
-
申请号： US14235692申请日： 2012-07-27
-
公开(公告)号： US09357630B2公开(公告)日： 2016-05-31
- 发明人: Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
- 申请人： Sung Bae Moon , Jae Man Park , Jong Heum Yoon , Hae Yeon Kim , In Hee Cho
- 申请人地址： KR Seoul
- 专利权人： LG INNOTEK CO., LTD.
- 当前专利权人： LG INNOTEK CO., LTD.
- 当前专利权人地址： KR Seoul
- 代理机构： Saliwanchik, Lloyd & Eisenschenk
- 优先权： KR10-2011-0075462 20110728
- 国际申请： PCT/KR2012/006041 WO 20120727
- 国际公布： WO2013/015659 WO 20130131
- 主分类号： C08G59/18
- IPC分类号： C08G59/18 ; C08G59/20 ; C08G59/50 ; C08L63/00 ; H05K1/05 ; H01L23/14 ; H01L23/373 ; H05K1/02 ; H05K1/03
摘要：
Disclosed are an epoxy resin compound and a radiant heat circuit board using the same. The epoxy resin compound mainly includes an epoxy resin, a curing agent, and an inorganic filler. The curing agent comprises epoxy adducts formed to add the curing agent to a crystalline epoxy resin. The epoxy resin is used on a printed circuit board as an insulating material, so that a substrate having a high heat radiation property is provided.
公开/授权文献
信息查询
