Invention Grant
- Patent Title: Flexible printed circuit board and method for making same
- Patent Title (中): 柔性印刷电路板及其制作方法
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Application No.: US14162769Application Date: 2014-01-24
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Publication No.: US09357631B2Publication Date: 2016-05-31
- Inventor: Ming-Jaan Ho , Xian-Qin Hu , Shao-Hua Wang , Fu-Yun Shen
- Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
- Applicant Address: CN Shenzhen TW Tayuan, Taoyuan
- Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW Tayuan, Taoyuan
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN2013103277488 20130731
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K3/28

Abstract:
An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.
Public/Granted literature
- US20150034364A1 FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME Public/Granted day:2015-02-05
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