发明授权
- 专利标题： Joined structural body of members, joining method of members, and package for containing an electronic component
- 专利标题（中）： 构件的结合体，构件的接合方法和用于容纳电子部件的包装
-
申请号： US14524282申请日： 2014-10-27
-
公开(公告)号： US09357644B2公开(公告)日： 2016-05-31
- 发明人: Kazutaka Takagi
- 申请人： KABUSHIKI KAISHA TOSHIBA
- 申请人地址： JP Minato-ku
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Minato-ku
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2011-235385 20111026
- 主分类号： H01L23/047
- IPC分类号： H01L23/047 ; H05K1/09 ; H01L23/10 ; H05K1/11 ; H01L23/66
摘要：
According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal.
公开/授权文献
信息查询
IPC分类:
