Invention Grant
- Patent Title: Trimmer apparatus
- Patent Title (中): 微调仪器
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Application No.: US14575470Application Date: 2014-12-18
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Publication No.: US09358695B2Publication Date: 2016-06-07
- Inventor: Kenji Baba , Chiaki Osada , Hirokazu Tanaka
- Applicant: Kenji Baba , Chiaki Osada , Hirokazu Tanaka
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: SEIKO LTD.
- Current Assignee: SEIKO LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agent Manabu Kenesaka
- Priority: JP2013-262107 20131219; JP2013-262108 20131219; JP2014-146848 20140717
- Main IPC: B26D7/18
- IPC: B26D7/18 ; B26D7/02 ; B26D1/18 ; B26D1/20 ; B26D5/06 ; B26D7/00

Abstract:
A trimming apparatus trims by cutter blades running from one end of a sheet bundle to the other end thereof, includes a bed surface for the sheet bundle, cutter blades for cutting the sheet bundle supported on the bed surface, a drive device for running the cutting blades from one end of the sheet bundle to the other end thereof, a support member having a support face, and a shift device for moving the support member between a working position for the support member supporting cut sheet dust pieces and a retreating position not to hinder the cut sheet dust pieces from dropping. The shift device displaces the support face from the working position to a retreating position after the cutter blades move at a predetermined distance toward the other end of the sheet bundle from one end thereof.
Public/Granted literature
- US20150174781A1 TRIMMER APPARATUS Public/Granted day:2015-06-25
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