Invention Grant
US09358729B2 Method for selective laser sintering and system for selective laser sintering suitable for said method
有权
选择性激光烧结方法和适用于所述方法的选择性激光烧结体系
- Patent Title: Method for selective laser sintering and system for selective laser sintering suitable for said method
- Patent Title (中): 选择性激光烧结方法和适用于所述方法的选择性激光烧结体系
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Application No.: US13825893Application Date: 2011-09-22
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Publication No.: US09358729B2Publication Date: 2016-06-07
- Inventor: Oliver Hofacker , Martin Schäfer
- Applicant: Oliver Hofacker , Martin Schäfer
- Applicant Address: DE Munich
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE Munich
- Agency: Slayden Grubert Beard PLLC
- Priority: DE102010041284 20100923
- International Application: PCT/EP2011/066516 WO 20110922
- International Announcement: WO2012/038507 WO 20120329
- Main IPC: B29C67/04
- IPC: B29C67/04 ; B22F3/105 ; B29C67/00

Abstract:
A method and a device perform selective laser sintering. In the method for laser sintering, energy is applied linearly to a cross-sectional surface of the component to be produced in order to compact the powdery material. In the case of components with cross-sectional surfaces that have a curved contour, the application of energy can be guided in a line-shaped manner following the curved contour so that the contour of the workpiece that develops is continuously replicated. Advantageously, irregularities in the contour, which are caused by the raster predetermined by the laser sintering method, can thus be largely avoided. The device for laser sintering includes a powder delivery unit which can rotate about a rotational axis located in the interior of an annularly closed cross-section of the workpiece to be produced.
Public/Granted literature
- US20130264750A1 METHOD FOR SELECTIVE LASER SINTERING AND SYSTEM FOR SELECTIVE LASER SINTERING SUITABLE FOR SAID METHOD Public/Granted day:2013-10-10
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