Invention Grant
- Patent Title: Stacked semiconductor device
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Application No.: US14858888Application Date: 2015-09-18
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Publication No.: US09362002B2Publication Date: 2016-06-07
- Inventor: Frederick A. Ware
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Peninsula Patent Group
- Agent Lance Kreisman
- Main IPC: G11C11/34
- IPC: G11C11/34 ; G11C17/18 ; G11C5/04 ; H01L25/065 ; G11C11/4096 ; G11C17/16 ; H01L25/18 ; H01L23/00

Abstract:
A stacked semiconductor device is disclosed that includes a plurality of semiconductor dies. Each die has oppositely disposed first and second surfaces, with pads formed on each of the surfaces. A plurality of through-vias connect respective pads on the first surface to respective pads on the second surface. The through-vias include a first group of through-vias coupled to respective I/O circuitry on the semiconductor die and a second group of through-vias not coupled to I/O circuitry on the semiconductor die. The plurality of semiconductor dies are stacked such that the first group of through-vias in a first one of the plurality of semiconductor dies are aligned with respective ones of at least a portion of the second group of through-vias in a second one of the plurality of semiconductor dies.
Public/Granted literature
- US20160012910A1 STACKED SEMICONDUCTOR DEVICE Public/Granted day:2016-01-14
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