Invention Grant
- Patent Title: Electronic component and manufacturing method thereof
- Patent Title (中): 电子元器件及其制造方法
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Application No.: US14162683Application Date: 2014-01-23
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Publication No.: US09362043B2Publication Date: 2016-06-07
- Inventor: Tomohiro Kido , Miho Kitamura , Tetsuzo Hara , Nobuhiro Ishida
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP2011-188180 20110831
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F5/00 ; H01F27/30 ; H01F27/28 ; H01F41/04 ; H01F17/00

Abstract:
A magnetic substrate has such a shape that ridges extending between principal surfaces are cut away by cutout portions. A multilayer body has corners arranged so as to overlap the cutout portions. A coil includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. A coil is combined with the coil to constitute a common mode choke coil and includes lead portions which are connected with both ends of a coil portion and which are drawn out to the corners. Connecting portions connect external electrodes to the lead portions and are provided at the cutout portion.
Public/Granted literature
- US20140139307A1 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-05-22
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