发明授权
- 专利标题： Semiconductor package and mobile device using the same
- 专利标题（中）： 半导体封装和移动设备使用相同
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申请号： US13181737申请日： 2011-07-13
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公开(公告)号： US09362196B2公开(公告)日： 2016-06-07
- 发明人: Keiju Yamada , Takashi Yamazaki , Masatoshi Fukuda , Yasuhiro Koshio
- 申请人： Keiju Yamada , Takashi Yamazaki , Masatoshi Fukuda , Yasuhiro Koshio
- 申请人地址： JP Tokyo
- 专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Tokyo
- 代理机构： Oblon, McClelland, Maier & Neustadt, L.L.P
- 优先权： JP2010-160980 20100715
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/31 ; H01L23/498 ; H01L23/552 ; H01L23/00
摘要：
According to an embodiment, a semiconductor package includes a semiconductor chip mounted on an interposer board, a encapsulant sealing the semiconductor chip, and a conductive shielding layer covering the encapsulant and at least part of a side surface of the interposer board. The interposer board has plural vias through an insulating substrate. A part of the plural vias has a cutting plane exposing to the side surface of the interposer board and cut in a thickness direction of the interposer board. The cutting plane of the via is electrically connected to the conductive shielding layer.
公开/授权文献
- US20120015687A1 SEMICONDUCTOR PACKAGE AND MOBILE DEVICE USING THE SAME 公开/授权日：2012-01-19
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