Invention Grant
- Patent Title: Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
- Patent Title (中): 具有基本上刚性支撑构件的封装半导体部件和封装半导体部件的方法
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Application No.: US14821550Application Date: 2015-08-07
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Publication No.: US09362208B2Publication Date: 2016-06-07
- Inventor: Matt E. Schwab , J. Michael Brooks , David J. Corisis
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50 ; H01L23/492 ; H01L23/16 ; H01L23/31 ; H01L25/065 ; H01L23/36 ; H01L23/00
Abstract:
Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.
Public/Granted literature
Information query
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