- 专利标题： Semiconductor device
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申请号： US14919597申请日： 2015-10-21
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公开(公告)号： US09362238B2公开(公告)日： 2016-06-07
- 发明人: Katsuhiko Funatsu , Yukihiro Sato , Yuichi Yato , Tomoaki Uno
- 申请人： RENESAS ELECTRONICS CORPORATION
- 申请人地址： JP Tokyo
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Shapiro, Gabor and Rosenberger, PLLC
- 优先权： JP2013-138155 20130701
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L23/00 ; H01L21/78 ; H01L21/56 ; H01L21/48
摘要：
A semiconductor device includes a first chip mounting portion, a first semiconductor chip arranged over the first chip mounting portion, a first pad formed in a surface of the first semiconductor chip, a first lead which serves as an external coupling terminal, a first conductive member which electrically couples the first pad and the first lead, and a sealing body which seals a part of the first chip mounting portion, the first semiconductor chip, a part of the first lead, and the first conductive member. The first conductive member includes a first plate-like portion, and a first support portion formed integrally with the first plate-like portion. An end of the first support portion is exposed from the sealing body, and the first support portion is formed with a first bent portion.
公开/授权文献
- US20160043042A1 SEMICONDUCTOR DEVICE 公开/授权日：2016-02-11
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