A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.