Invention Grant
US09362339B2 Semiconductor elements stacked and bonded with an anisotropic conductive adhesive 有权
用各向异性导电粘合剂堆叠和结合的半导体元件

Semiconductor elements stacked and bonded with an anisotropic conductive adhesive
Abstract:
The invention provides a semiconductor device which is non-volatile, easily manufactured, and can be additionally written. A semiconductor device of the invention includes a plurality of transistors, a conductive layer which functions as a source wiring or a drain wiring of the transistors, and a memory element which overlaps one of the plurality of transistors, and a conductive layer which functions as an antenna. The memory element includes a first conductive layer, an organic compound layer and a phase change layer, and a second conductive layer stacked in this order. The conductive layer which functions as an antenna and a conductive layer which functions as a source wiring or a drain wiring of the plurality of transistors are provided on the same layer.
Public/Granted literature
Information query
Patent Agency Ranking
0/0