An encapsulation structure of OLED device, comprising an upper substrate and a lower substrate that are disposed in opposition to each other. An OLED device is provided on the lower substrate, and an encapsulating thin film is provided on the OLED device. An edge of the lower substrate and an edge of the upper substrate are hermetically coupled through an obstruction wall, and there is a recess at the edge of the lower substrate on the side facing the upper substrate. One end of the obstruction wall that is coupled to the lower substrate is positioned within the recess of the lower substrate, and configured to seal the periphery of the encapsulating thin film within the recess of the lower substrate. With the encapsulation structure, the effect of water vapor and oxygen on the OLED device can be reduced, and service life of the OLED device is prolonged.