Invention Grant
- Patent Title: Electromagnetic wave propagation path and electromagnetic wave propagation device
- Patent Title (中): 电磁波传播路径和电磁波传播装置
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Application No.: US14131543Application Date: 2011-07-11
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Publication No.: US09362605B2Publication Date: 2016-06-07
- Inventor: Hiroshi Shinoda , Takahide Terada , Kazunori Hara
- Applicant: Hiroshi Shinoda , Takahide Terada , Kazunori Hara
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- International Application: PCT/JP2011/065764 WO 20110711
- International Announcement: WO2013/008292 WO 20130117
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H01P3/02 ; H01P5/02

Abstract:
An electromagnetic wave propagation device includes multiple planar propagation media each formed by laminating at least one planar conductor and at least one planar dielectric, multiple transceivers for transmitting and receiving information among electronic apparatuses, and a first interface for transmitting and receiving the electromagnetic wave between the transceivers and the planar propagation media. Planar dielectric spacers are provided for isolating the multiple planar propagation media from one another. The planar propagation medium is disposed to have an overlapped part with at least the other of the planar propagation media so that an obverse face of the medium and a reverse face of the other medium are at least partially overlapped with each other. The planar conductor is provided with an electromagnetic wave linking unit at the overlapped part that transmits and receives the electromagnetic wave between the planar propagation media.
Public/Granted literature
- US20140167882A1 ELECTROMAGNETIC WAVE PROPAGATION PATH AND ELECTROMAGNETIC WAVE PROPAGATION DEVICE Public/Granted day:2014-06-19
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