Invention Grant
- Patent Title: Connector assembly with improved contact arrangement
- Patent Title (中): 连接器组件具有改进的接触布置
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Application No.: US14249899Application Date: 2014-04-10
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Publication No.: US09362675B2Publication Date: 2016-06-07
- Inventor: Wang-I Yu , Hung-Chi Tai , Yung-Chih Hung
- Applicant: ALLTOP ELECTRONICS (SUZHOU) CO., LTD.
- Applicant Address: CN Taicang
- Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
- Current Assignee Address: CN Taicang
- Agency: Sughrue Mion, PLLC
- Priority: CN201310714990 20131223
- Main IPC: H01R13/64
- IPC: H01R13/64 ; H01R12/72 ; H01R13/627 ; H01R107/00 ; H01R12/70 ; H01R13/41

Abstract:
A connector assembly includes a receptacle connector and a plug connector. The plug insulative housing includes a body portion having a mating surface, a number of cavities extending through the mating surface and a number of contact-receiving slots. The number of male contacts are divided into groups each of which includes two male contacts in parallel relationship. Each male contact includes a contacting portion residing in corresponding cavity, a mounting portion perpendicular to the contacting portion and an inclined portion connecting the contact portion and the mounting portion. In each group, a distance between the contacting portions is larger than a gap between the inclined portions, and the gap between the inclined portions is no less than a gap between the mounting portions.
Public/Granted literature
- US20150180176A1 CONNECTOR ASSEMBLY WITH IMPROVED CONTACT ARRANGEMENT Public/Granted day:2015-06-25
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