- 专利标题: Modular interconnect structure
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申请号: US13193238申请日: 2011-07-28
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公开(公告)号: US09363203B2公开(公告)日: 2016-06-07
- 发明人: Martin S. Denham
- 申请人: Martin S. Denham
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Schwegman Lundberg & Woessner, P.A.
- 主分类号: H04L12/50
- IPC分类号: H04L12/50 ; H04L12/58 ; G06F15/173 ; G06F15/16 ; G06F13/00 ; H04L12/933 ; H04L12/935
摘要:
Some embodiments of the invention include an interconnect structure to transfer data among a plurality of devices. The interconnect structure includes a crossbar and a number of interconnect branches coupled to the crossbar. Each of the interconnect branches includes a number of connector circuits coupled in series to transfer data in a group of devices of the plurality of devices. The crossbar includes a number of connector circuits coupled in series to allow one group of devices from one interconnect branch to exchange data with another group of devices from another interconnect branch. Other embodiments are described and claimed.
公开/授权文献
- US20120020365A1 MODULAR INTERCONNECT STRUCTURE 公开/授权日:2012-01-26
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