Invention Grant
- Patent Title: Anisotropic conductive adhesive with reduced migration
- Patent Title (中): 各向异性导电胶粘剂减少迁移
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Application No.: US14054529Application Date: 2013-10-15
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Publication No.: US09365749B2Publication Date: 2016-06-14
- Inventor: S. Kumar Khanna
- Applicant: SunRay Scientific, LLC
- Applicant Address: US NJ Long Branch
- Assignee: Sunray Scientific, LLC
- Current Assignee: Sunray Scientific, LLC
- Current Assignee Address: US NJ Long Branch
- Agency: Barnes & Thornburg LLP
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C09J11/00 ; H01L23/00 ; H05K3/32 ; C08K9/08

Abstract:
Illustrative embodiments of an anisotropic conductive adhesive (ACA) configured to be cured after being subjected to a magnetic field are disclosed. In at least one illustrative embodiment, the ACA may comprise a binder and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material and with a moisture barrier, such that the electrically conducting material forms electrically conductive and isolated parallel paths when the ACA is cured after being subjected to the magnetic field.
Public/Granted literature
- US20140353540A1 Anisotropic Conductive Adhesive with Reduced Migration Public/Granted day:2014-12-04
Information query
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