Invention Grant
- Patent Title: Apparatus comprising a flexible substrate and a component supported by the flexible substrate
- Patent Title (中): 装置包括柔性基板和由柔性基板支撑的部件
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Application No.: US13760698Application Date: 2013-02-06
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Publication No.: US09366708B2Publication Date: 2016-06-14
- Inventor: Richard White , Samiul Haque
- Applicant: Nokia Corporation
- Applicant Address: FI Espoo
- Assignee: Nokia Technologies Oy
- Current Assignee: Nokia Technologies Oy
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: G01R27/26
- IPC: G01R27/26 ; G01R3/00 ; G06F3/041 ; G06F3/044
Abstract:
An apparatus including a flexible substrate; a component supported by the flexible substrate; a first input electrode, supported by the flexible substrate and configured to form a first capacitor with a second input electrode and to provide an input to the component; and a first output electrode, supported by the flexible substrate and configured to form a second capacitor with a second output electrode and to provide an output from the component.
Public/Granted literature
- US20140218057A1 Apparatus Comprising a flexible Substrate and a Component Supported by the Flexible Substrate Public/Granted day:2014-08-07
Information query
