Invention Grant
- Patent Title: Electronic part
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Application No.: US14450347Application Date: 2014-08-04
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Publication No.: US09368279B2Publication Date: 2016-06-14
- Inventor: Hidekiyo Takaoka , Kosuke Nakano , Yutaka Ota , Kenichi Kawasaki
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2012-048026 20120305
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/232 ; H01G2/04 ; H01G4/008 ; H01G4/252

Abstract:
An electronic part that includes an electronic part main body and an external electrode on the surface of the electronic part main body. The external electrode includes at least one alloy layer selected from among a Cu—Ni alloy layer and a Cu—Mn alloy layer, and a Sn-containing layer on the outer side of the alloy layer. The Sn-containing layer is the outermost layer of the external electrode. The Sn-containing layer is in contact with the alloy layer.
Public/Granted literature
- US09412517B2 Electronic part Public/Granted day:2016-08-09
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