Invention Grant
- Patent Title: Semiconductor devices having bridge layer and methods of manufacturing the same
- Patent Title (中): 具有桥接层的半导体器件及其制造方法
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Application No.: US14576368Application Date: 2014-12-19
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Publication No.: US09368495B2Publication Date: 2016-06-14
- Inventor: Seok-Hoon Kim , Jin-Bum Kim , Kwan-Heum Lee , Byeong-Chan Lee , Cho-Eun Lee , Jin-Hee Han , Bon-Young Koo
- Applicant: Seok-Hoon Kim , Jin-Bum Kim , Kwan-Heum Lee , Byeong-Chan Lee , Cho-Eun Lee , Jin-Hee Han , Bon-Young Koo
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2014-0057209 20140513
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/088 ; H01L27/02 ; H01L29/78

Abstract:
A semiconductor device includes a substrate, a first active fin and a second active fin on the substrate, respectively, a plurality of first epitaxial layers on the first active fin and on the second active fin, respectively, a plurality of second epitaxial layers on the plurality of first epitaxial layers, a bridge layer connecting the plurality of second epitaxial layers to each other, and a third epitaxial layer on the bridge layer.
Public/Granted literature
- US20150333061A1 SEMICONDUCTOR DEVICES HAVING BRIDGE LAYER AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2015-11-19
Information query
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