Invention Grant
US09370104B2 Lid body portion and electronic device package using the lid body portion and electronic device
有权
盖体部分和使用盖体部分和电子装置的电子装置封装
- Patent Title: Lid body portion and electronic device package using the lid body portion and electronic device
- Patent Title (中): 盖体部分和使用盖体部分和电子装置的电子装置封装
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Application No.: US14331811Application Date: 2014-07-15
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Publication No.: US09370104B2Publication Date: 2016-06-14
- Inventor: Masayuki Satoh , Kenji Takano , Mitsuo Akiba , Hitoshi Takeuchi , Shuhei Kaneko
- Applicant: Seiko Instruments Inc. , KAGA, INC.
- Applicant Address: JP Chiba-Ken JP Kanagawa
- Assignee: SEIKO INSTRUMENTS INC.,KAGA, INC.
- Current Assignee: SEIKO INSTRUMENTS INC.,KAGA, INC.
- Current Assignee Address: JP Chiba-Ken JP Kanagawa
- Agency: Brinks Gilson & Lione
- Priority: JP2013-147628 20130716
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01L23/04 ; H01L23/055 ; H05K1/03 ; H05K1/11
Abstract:
To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion.
Public/Granted literature
- US20150022988A1 LID BODY PORTION AND ELECTRONIC DEVICE PACKAGE USING THE LID BODY PORTION AND ELECTRONIC DEVICE Public/Granted day:2015-01-22
Information query
