Invention Grant
- Patent Title: Joint structure for assembling floorboards
- Patent Title (中): 用于组装地板的接头结构
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Application No.: US13950312Application Date: 2013-07-25
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Publication No.: US09371653B2Publication Date: 2016-06-21
- Inventor: Qianyi Liu
- Applicant: Qianyi Liu
- Agency: Matthias Scholl, PC
- Agent Matthias Scholl
- Priority: CN201110035241 20110129
- Main IPC: E04F15/02
- IPC: E04F15/02

Abstract:
A joint structure for a floorboard, including: at least one first beveled tenon, the first beveled tenon including a tenon face facing upwards; a first beveled mortise, the first beveled mortise including a mortise face facing upwards; at least one second beveled tenon, the second beveled tenon including a tenon face facing downwards; and a second beveled mortise, the second beveled mortise including a mortise face facing downwards. The first beveled tenon is disposed in parallel to a surface of the floorboard at a right edge approximately half a height of the floorboard; the first beveled mortise is disposed at an inner side of the first beveled tenon. The second beveled tenon is disposed at a left edge approximately half the height of the floorboard. The second beveled mortise is disposed at an inner side of the second beveled tenon.
Public/Granted literature
- US20130305650A1 JOINT STRUCTURE FOR ASSEMBLING FLOORBOARDS Public/Granted day:2013-11-21
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