A microelectromechanical sensor includes a supporting structure and a sensing mass, which is elastically coupled to the supporting structure, is movable with respect thereto with one degree of freedom in response to movements according to an axis and is coupled to the supporting structure through a capacitive coupling. A sensing device senses, on terminals of the capacitive coupling, transduction signals indicative of displacements of the first sensing mass according to the degree of freedom. The sensing device includes at least one first reading chain, having first operative parameters, one second reading chain, having second operative parameters different from the first operative parameters, and one selective electrical connection structure that couples the first reading chain and the second reading chain to the first terminals.