发明授权
US09373553B2 Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
有权
树脂涂布装置，光学特性校正装置和方法以及制造LED封装的方法
- 专利标题： Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
- 专利标题（中）： 树脂涂布装置，光学特性校正装置和方法以及制造LED封装的方法
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申请号： US14145101申请日： 2013-12-31
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公开(公告)号： US09373553B2公开(公告)日： 2016-06-21
- 发明人: Sang Bok Yoon , Hae Yong Eom , Mi Hwa You , Seung Min Hong , Sang Hoon Lee , Yong Gu Kim
- 申请人： SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址： KR Suwon-Si, Gyeonggi-Do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-Si, Gyeonggi-Do
- 优先权： KR10-2009-0080146 20090828; KR10-2009-0127374 20091218; KR10-2009-0130966 20091224
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L21/66 ; H01L21/56 ; H01L33/50 ; H01L23/00 ; H01L27/15 ; G01R31/28 ; H01L33/54
摘要：
A resin application apparatus includes: an optical property measurement unit measuring an optical property of light emitted from a light emitting diode (LED) chip which is mounted on a package body and to which transparent resin is not applied; and a resin application unit applying light conversion material-containing transparent resin to the LED chip in accordance with a resin application amount which is decided depending on the optical property measured by the optical measurement unit.
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